Effortlessly detangles while boosting moisture and strength for healthy, vibrant hair
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Bond Complex
The innovative Bond Complex Technology (patent pending) works by penetrating deeply into the hair fiber to reconnect broken disulfide bonds caused by damage such as brushing, combing, or chemical treatments. This process strengthens the hair structure, restoring elasticity and promoting long-lasting health and resilience.
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Sub-micron technology
Sub-micron technology enables deeper penetration of ingredients by breaking them down into small particles. the smaller particles are able to penetrate the hair & scalp more efficiently, allowing our ingredients to strengthen the scalp’s protective barrier & provide better protection against damage or irritation.
What makes the Bond Leave-In Conditioner special?
The Bond Leave-In Conditioner is powered by advanced Bond Complex Technology, along with Ceramides, Amla, and Moringa, to strengthen, repair, and nourish damaged and dead hair. Designed for all hair types, it protects against future damage, reduces hair porosity, and enhances hair vibrance and shine.
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